
· 16 Layers Anylayer with ENEPIG
· Doosan DS-8502SQN
· Min. Line Width/Space 43/64um

· 16 Layers 7-Steps HDI with ENEPIG
· EMC EM-892K
· Impedance Tolerance ±8%
· Min. Line Width/Space 36um/48um

· 10 Layers 3-Steps HDI with ENIG
· EMC EM-892K2
· Min. Line Width/Space 70um/50um
· 16 Layers 7-Steps HDI with ENEPIG
· MSAP Process, Min. Line Space 0.04mm
· BGA Pitch 0.13mm, Spacing 0.02mm
· Impedance Tolerance ±8%

· 8 Layers 2-Steps HDI with ENIG
· EMC EM-890K
· Min. Line Width/Space 80um/80um

· 12 Layers 2-Steps HDI with ENEPIG
· Panasonic R-5670(G)
· Min. Line Width/Space 102um/107um

· 6 Layers Mechanical Blind Via PCB with ImAg & Gold Finger
· Rogers RO3003
· Min. Line Width/Space 80um/80um
· 8 Layers 2-Steps HDI with ENIG+Gold plating
· EMC EM-892K2
· Impedance Tolerance ±5%
· Insertion Loss Requirement: 0.497 dB/inch @ 26.56 GHz
· 12-Layer 5 Steps ELIC HDI with ENEPIG
· Very Low loss, Low DK materials
· 76/50um Bonding pad
· Impedance tolerance ±8%

· 12 Layers 5-Steps HDI with ENEPIG
· EMC EM-528K
· Depth Controlled Routing & Plated Cavity
· Min. Line Width/Space 30um/30um